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New 3D printer from BMF – MicroArch® S150

Meet the new 3D printer from BMF – MicroArch® S150 Industrial Micro-Precision – Now more accessible The new MicroArch® S150 brings BMF’s micro-precision to a compact, high-performance platform, offering access to 25µm optical resolution in a more accessible and user-friendly format. Designed with both performance and practicality in mind, the new S150 features a fully […]

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Pastis3

We recently did the mechanical construction and machining for a device called Pastis3 for Institut Laue Langevin. The Pastis3/PANTHER insert represents the third generation of the PASTIS device, enabling XYZ neutron polarization analysis as an optional upgrade for existing ILL (Institut Laue Langevin) instruments equipped with wide-angle detector coverage. PASTIS-3 utilizes two polarized 3He Neutron

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Formnext 2025

It is with joy that we can say that Teccluster is participating in Formnext 2025 Formnext is the worlds leading fair for additive manufacturing, which is happening on the 18-21. November in Frankurt in Germany. Formnext brings the entire world of additive manufacturing together, a place where almost every country and industry passionate about 3d

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Wayland Additive Partners with Teccluster Across Nordic & Baltic Regions for Sales of Calibur3

Huddersfield, UK: November 25th, 2024. As you may have noticed, things are ramping up at Wayland Additive, and the company is excited to announce a further partnership agreement, with Teccluster A/S based in Denmark. Per Lynnerup is the Technical and Managing Director of Teccluster, an engineering company with more than 30 years of experience with

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Formnext 2024

From one fair and onwards to the next. It is with joy that we can say that Teccluster is participating in Formnext 2024 Formnext is the worlds leading fair for additive manufacturing, which is happening on the 19-22. November in Frankurt in Germany. Formnext is the biggest gathering place for additive manufacturing, where almost every

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Teccluster will exhibit at Elmia Subcontrator 2024!

We are pleased to announce that Teccluster will be participating in Elmia Subcontractor 2024! It is the Nordics largest industry fair, which will be happening on the 12-14. November at Elmia, Jönköping, Sweden, Mässvägen 23, 554 54 Jönköping. Elmia Subcontractor is the gathering place for the decision makers in the manufacturing industry, so don’t miss

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BMFs MicroArch 3D printers can now use 4 new materials to print with!

BMFs MicroArch 3D printers can now use 4 new materials to print with! Figure 4® HI TEMP 300-AMB: which can tolerate temperatures up to 300°C. Ultracur3D 3280: ceramic-filled resin with extreme stiffness which can tolerate temperatures to over 280°C. HTF (High-Temp): Bio-compatible autoclave-sterilizable resin which can tolerate temperatures up to 152°C. SR (Sacrificial Resin): Soluble

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